MediaTek Dimensity 8100 chip parameters exposure: TSMC 5nm process, Redmi, realme mass production machines to debut next month.
Digital blogger @Digital Chat Station exposed the core parameters of the MediaTek Dimensity 8100 chip.
According to reports , this processor uses TSMC’s 5nm process technology , has 4 2.85GHz A78 cores and 4 2.0GHz A55 cores , with G610 MC6 GPU, equipped with the same 4MB L3 cache as Snapdragon 888, supports LPDDR5 and UFS 3.1.
The blogger also said that the Dimensity 8000 series is very strong in the mid-end market. Redmi and realme mass-produced machines will be unveiled next month , and other manufacturers will use this processor later.
According to previous reports, the Dimensity 8000 series includes the Dimensity 8000 and the more frequent Dimensity 8100 . Among them, Dimensity 8100 is benchmarked against Snapdragon 888, Dimensity 8000 is benchmarked against Snapdragon 870, and the previously released Dimensity 9000 is the flagship benchmark for Snapdragon 8 Gen 1.
Boldtechinfo learned that the Dimensity 9000 will be released in the fourth quarter of 2021. It adopts TSMC’s 4nm process + Armv9 architecture combination, and has one 3.05GHz Arm Cortex-X2 super core and three 2.85GHz Arm Cortex-A710 large cores with 4 Arm Cortex-A510 small cores.
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